8) This describes the essential skills and knowledge and their level, required for this unit. Evidence must show that knowledge has been acquired of safe working practices and lead-free soldering techniques for connecting/de-connecting electronic components. All knowledge and skills detailed in this unit should be contextualised to current industry practices and technologies. KS01-EA106A Lead-free soldering techniques Evidence shall show an understanding of Lead-free soldering techniques, applying safe working practices and relevant Standards, Codes and Regulations to an extent indicated by the following aspects: T1. Enterprise quality management system encompassing: purpose of a quality system procedures pertaining to the relevant work function work instructions pertaining to the relevant work function T2. Lead-free solder issues encompassing: safety environmental T3. Solder types and characteristics encompassing: solder wires and pastes - including bimetal and trimetal solder characteristics - including melt and wetting temperatures, soldering temperature and flow behaviour. characteristic differences between lead and lead-free solders. industry standards T4. Types of fluxes and their activity level encompassing: water soluble, no-clean and cleanable fluxes T5. Component requirements for lead-free soldering encompassing: printed Circuit board (PCB) - including HAZL, ID marking, conformance certificates and re-working old PCBs component considerations - including lead/end cap material, temperature capability and the like. T6. Lead-free soldering cleaning requirements encompassing: chemicals and consumable materials, when to clean, white residues and the like. T7. Equipment requirements encompassing: temperature stability, recovery capability, tip size, tip shape, tip metal mass, tin erosion and the like. T8. Soldering techniques encompassing: soldering tip selection, temperature setting, preheating, use of soldering irons and the like. T9 Completed soldered connections compliance requirements |